High power ultraviolet UV LED COB chip on board 20W - 365nm 385nm 395nm 405nm - UV.Chingtek.net
  UV Technology - UV LED (Ultraviolet LED) - UV.Chingtek.net
Chingtek Electronics Corp.

Products to Order Photos of customers support contact
6-1
The UV-LED chips 320W by COB packing.
6-2
High power ultraviolet UV LED COB chip on board 100W up 365nm 385nm 395nm 405nm - 100W Spotlight 60D - UV.Chingtek.net
6-3
The UV-LED chips 20W by COB packing.

UV LED - 20W - COB type

(UVA 365nm - 415nm )

High power ultraviolet UV LED COB chip on board 20W - 365nm 385nm 395nm 405nm - UV.Chingtek.net

  ----- Key Features -----
   
- Supply wide UV-A wavelength from 365nm to 415nm
- Half Angle (2c1/2) : 120X
- Lens Color : Silicone Water Clear
- Die Direct bonding to copper
- High thermal conductivity: 401W/(mPK)
- Thermocouple attach point
-
Chip on Board high heat dissipation structure
   
  ----- Applications -----
   
- Curing:
  > Inks > Coatings > Adhesives
- Inspection
- Machine Vision
- Fiber-coupled illumination
- Specialty Projection Systems for Maskless Lithography
- Rapid Prototyping and 3D printing
- Medical and Scientific Instrumentation
   

 

  Package Dimensions (mm) :


Notes :
1. All dimensions are in millimeters
2. Tolerance is 0.25mm



Technology of Overviews
The COB Multi-chips LED package benefit from innovations in device technology, chip package and thermalmanagement. This suite of technologies give engineers and system designers the freedom to develop solutions both high in power and efficiency.
 
The Technology
 
Reliability Technology
our technology enables to emit large area photons uniformly over the entire COB UV LED surface. The intense optical power density produced by these multi-chips facilitate designs which replace mercury lamps where arrays of traditional power LEDs cannot.
  Designed from the ground up, the COB Multi-chips LEDs are one of the most reliable light sources in the world today. COB Multi-chips LEDs have passed a rigorous suite of environmental and mechanical stress tests, including mechanical shock, vibration, temperature cycling and humidity, and high current applications. With very low failure rates and median lifetimes that typically exceed 10,000 hours, the COB Multi-chips LEDs are ready for evern the most demanding applications.
 
   
     
Packaging Technology
 
Environmental Benefits
Thermal management is critical in high power LED applications. The UV LEDs have the lowest thermal resistance of any LED on the market with a thermal resistance from junction to heat sink of 0.3XC/W or 0.35XC/W. This allows the LED to be driven at higher current densities while maintaining a low junction temperature, thereby resulting in brighter solutions and longer lifetimes.   our LEDs help reduce power consumption and the amount of hazardous waste entering the environment. All COB Multi-chips LED products manufactured by us are RoHS compliant and free fo hazardous materials, including lead and mercury.
 


The Advantages of COB Multi-chips LEDs

Every LED is fully designed to ensure that it meets the high quality standards expected from our products.
>>> Low Thermal Resistance <0.16XC/W / High thermal conductivity 401W/(m.K)
  Copper Substrate and LED Chip Direct Bonding on Cu Base
   
>>> Special Reflecting Surface
  No Ag Plating, Anti-Sulfide, and Low Light Decay.
   
>>> Ni Coating at the Cu substrate bottom
  Anti-Oxidized and SMT Compatible.
   
The Advantages of COB Multi-chips LEDs


Electrical/Optical Characteristics (Ta=25XC)
Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Irradiance Note[1]
Ee
IF=1400mA
360
mW/cm2
Peak Wavelength
ELP
IF=1400mA
365
420
nm
Forward Voltage
VF
IF=1400mA
12
16

V

Thermal Resistance
JunctionTo Board
RthJ-B
IF=1400mA
0.2
XC/W
Temperature
Coefficient of
Forward Voltage
GVF/GT
IF=1400mA
8
mV/XC
Reverse Current
IR
VR=5V
10
gA
Viewing Angle Note[2]
2c1/2
IF=1400mA
100
120
140
Degree
Note : [1] Irradiance measured by UV Intensity Meter, and the distance of Test is 5mm.
[2] Tolerance c:10X


Absolute Maximum Rating (Ta=25XC)
Parameter
Symbol
Conditions
Units
Power Dissipation
PD
20

W

Continuous Forward Current
IF
2000
mA
Peak Forward CurrentNote[1]
IF(Peak)
2800
mA
LED Junction Temperature
Tj
120
/XC
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
30J To +80J
Storage Temperature Range
Tstg
-40J To +100J
Manual Soldering Temperature
Tsol
260J20J For 3-5 Seconds
ESD Sensitivity Note[2]
ESD
500V HBM
Note: [1] 1/10 Duty Cycle 0.1ms Pulse Width.
[2] Singe chip ESD.



UV COB LED Spectrum Distribution

UV COB LED Spectrum Distribution



Assembly Notice

1) Do not touch emitting area.
- Do not touch or scratch silicon forming matrix area since it could damage the bonding
 

of LED chipsor wires and cause dead zone.

 
Dont touch the surface of Emitter
Dont touch the surface of Emitter
   
2.) Soldering methods
  a) Set up the temperature of welding head to 40010J when soldering.
  b) Put Emitter on a 10010J hot plate and set up welding head temperature to 30010J
  c) Either is OK.
   
3.) Wires
  Suggested using strand wires (softer) to connect power, dont use solid wires.
   

Used Notice

1.) In order to avoid absorption of moisture, it is recommended that the products are stored in the
  dry box (or desiccators ) with a desiccants. Alternatively the following environment is
  recommended: Storage temperature: 5XC ~ 30XC , Humidity: 60% HR Max.
   
2.) If the storage conditions are of high humidity the product should be dried before use.
  Recommended drying conditions: 12 hours at 100XC5XC
   
3.) Any mechanical force or any excess vibration should be avoid during the cooling process after
  soldering.
   
4.) Reflow rapidly cooling should be avoided.
   
5.) Components should not be mounted on distorted Printed Circuit Boards.
   
6.) TDevices should not contact with any types of fluid, such as water , oil , organic solventsK. etc.
   
7.) The maximum ambient temperature should be taken into consideration when determining the
  operating current.
   
8.) Devices should be soldered within 7 days after opening the moisture-proof packing.
   
9.) Repack unused product in anti-moisture packing, fold to close any opening and store in a dry
  place.
   
10.) The appearance and specifications of devices may be modified for improvement without notice.
   
11.) ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist
  bands or anti-electrostatic gloves be used when handing the LEDs . All devices, equipment and
  machinery should be properly grounded.
   
12.) This product must be driven by constant power supplier.
   



Ordering Information

Color
Order Code
Peak
Wavelength (nm)
Min
Max
UV
UVA-016-415
410
420
UVA-016-405
400
410
UVA-016-395
390
400
UVA-016-385
380
390
UVA-016-375
370
380
UVA-016-365
365
370





UV LED light wiht Hi-Power LED (UVA 400nm / 365nm ) - UV.Chingtek.net


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