High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - UV.Chingtek.net
  UV Technology - UV LED (Ultraviolet LED) - UV.Chingtek.net
Chingtek Electronics Corp.

Products to Order Photos of customers support contact
7-1
The Ultraviolet (UV) LED chips 3W by emitter packing - 365nm 375nm 385nm 395nm 405nm 415nm
7-2
The Infrared (IR) LED chips 3W by emitter packing - 660nm 850nm 940nm
7-3
The Cool White LED chips 3W by emitter packing - 5000k 6300k 7000k

High Power RYGB LED - 3W ( emitter packing )

( 440nm - 650nm )

High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - UV.Chingtek.net

  ----- Key Features -----
   
- 3W High Power Emitter LED
- Half Angle (2c1/2) : 140X
- Lens Color : Silicone Water Clear
- Silicone compression molding lens
   
  ----- Applications -----
   
- Entertainment Lighting
- Decorative Lighting
- Architectural Lighting
- Signal / Display
   

 

  Package Dimensions (mm) :

High power Ultraviolet (UV) LED chips 3W by emitter packing - 365nm 375nm 385nm 395nm 405nm 415nm - UV.Chingtek.net
Notes :
1. All dimensions are in millimeters
2. Tolerance is 0.25mm


Electrical/Optical Characteristics (Ta=25XC)

Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Luminous Flux
Xv
IF=700mA
5.6
420
lm
Dominate Wavelength
WLD
IF=700mA
440
650
nm
Forward Voltage
VF
IF=700mA
1.8
5.2

V

Thermal Resistance
JunctionTo Board
RthJ-B
IF=700mA
13
XC/W
Temperature
Coefficient of
Forward Voltage
GVF/GT
IF=700mA
2
mV/XC
Reverse Current
IR
VR=5V
10
gA
Viewing Angle Note[1]
2c1/2
IF=700mA
130
140
150
Degree



Absolute Maximum Rating (Ta=25XC)
Parameter
Symbol
Conditions
Units
Power Dissipation
PD
3

W

Continuous Forward Current
IF
700
mA
Peak Forward Current Note[2]
IF(Peak)
1000
mA
LED Junction Temperature
Tj
120
/XC
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
30J To +80J
Storage Temperature Range
Tstg
-40J To +100J
Manual Soldering Temperature
Tsol
260J20J For 3-5 Seconds
ESD Sensitivity
ESD
2000V HBM
Note: [1] Tolerance c:10X .
[2] 1/10 Duty Cycle 0.1ms Pulse Width.


Spectrum Distribution

Spectrum Distribution

UV LED Characteristic Curves


Characteristic Curves

Typical Radiation Pattern

Typical Radiation Pattern
Typical Radiation Pattern

Typical Reflow Soldering Profile

UV LED Typical Reflow Soldering Profile

Profile Feature
Typical parameters
Average Ramp-Up Rate (Ts max to Tp)
3 XC/second max.
Preheat Temperature Min (Ts min )
150 XC
Preheat Temperature Max (Ts max )
200 XC
Time (ts min to ts max )
60-180 seconds
Time maintained above Temperature (TL)
217 XC
Time maintained above Time (tL)
60-150 seconds
Peak/Classification Temperature (Tp)
260 XC
Time within 5 XC of Actual Peak Temperature (tp)
5 seconds
Ramp-Down Rate
6 XC/second max.
Time 25 XC to Peak Temperature
8 minutes max.


Tube Packing

UV LED Tube Packing
Unit : mm
W1
W2
H1
H2
L

16.5

9.6
8.0
3.4
424.0
0.2
0.2
0.2
0.2
2.0


Tape-and-Reel Packing

- Reel dimensions -
UV LED Tape-and-Reel Packing
Unit : mm
M
N
W
W1
H
K
S

X330.0

X99.5
24.4
29.0
X13.5
10.75
2.5
1.0
1.0
1.0
1.0
0.5
0.5
0.5


- Carrier tape dimensions -
UV LED Tape-and-Reel Packing
Unit : mm
W
P
E
F
P2
D
D1
P0
A0
B0
K0
T

24.0

12.0
1.75
11.5
2.0
1.5
1.5
4.0
8.45
15.0
5.10
0.37
0.3
0.1
0.1
0.1
0.1
0.1
0.25
0.1
0.1
0.1
0.1
0.02



Used Notice

1.) In order to avoid absorption of moisture, it is recommended that the products are stored in the
  dry box (or desiccators ) with a desiccants. Alternatively the following environment is
  recommended: Storage temperature: 5XC ~ 30XC , Humidity: 60% HR Max.
   
2.) If the storage conditions are of high humidity the product should be dried before use.
  Recommended drying conditions: 12 hours at 100XC5XC
   
3.) Any mechanical force or any excess vibration should be avoid during the cooling process after
  soldering.
   
4.) Reflow rapidly cooling should be avoided.
   
5.) Components should not be mounted on distorted Printed Circuit Boards.
   
6.) TDevices should not contact with any types of fluid, such as water , oil , organic solventsK. etc.
   
7.) The maximum ambient temperature should be taken into consideration when determining the
  operating current.
   
8.) Devices should be soldered within 7 days after opening the moisture-proof packing.
   
9.) Repack unused product in anti-moisture packing, fold to close any opening and store in a dry
  place.
   
10.) The appearance and specifications of devices may be modified for improvement without notice.
   
11.) ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist
  bands or anti-electrostatic gloves be used when handing the LEDs . All devices, equipment and
  machinery should be properly grounded.
   
12.) This product must be driven by constant power supplier.
   



Ordering Information

Color
Order Code
Dominate
Wavelength (nm)
Min
Max
RYGB
UVA-003-450
445
455
UVA-003-460
455
465
UVA-003-520
515
525
UVA-003-620
615
625





High power Ultraviolet (UV) LED chips 3W by emitter packing - 365nm 375nm 385nm 395nm 405nm 415nm


----------------------------------------------------------------------------------------------------------------------------------



the Inquiry for High power Red Yellow Green Blue LED chips 3W by emitter packing of UV.chingtek.net

-----------------------------------------------------------------------------

| Home | Products | To Order | Photos | Support | Contact |