High Power UV LED module/lamp

( 160W G2 Ultimate - COB type )

UVA 365nm - 405nm

         Key Features         

Board dimension of 56mm x 28mm, Basic power 160W With fine heat dissipation, able to scale 320W (Need more cooling).




Irradiation intensity scales high at higher current! (> 6 A operation) with High thermal conductivity package.




Environmentally friendly: RoHS compliant, mercury-free.




Variable drive currents: less than 4.5A through 12A or higher.




Easy use for Linear UV light source.




395nm irradiation intensity 8W/cm2 ~ 11W/cm2




365nm irradiation intensity 4W/cm2 ~ 5W/cm2

Easy use for Linear UV light source

You must need:
1.) Air/Water cooling heat sink:
The lower temperature you maintain on the COB board,the more intensity power you can run up to, along with longer life span.
2.) UV LED power driver
It's better with dimming function, but must be constant current supply.

The Easiest installation Powerful High Power Board to Start UV LED Curing !

Our customer’s project for reference !!

         Technology of Overviews         

The Multi-chips LED package benefit from innovations in device technology, chip package and thermalmanagement. This suite of technologies give engineers and system designers the freedom to develop solutions both high in power and efficiency.

         - The Technology -         

Our technology enables to emit large area photons uniformly over the entire COB UV LED surface. The intense optical power density produced by these multi-chips facilitate designs which replace mercury lamps where arrays of traditional power LEDs cannot.

For UV devices, the side-less structure to let the engineers easy to design the linear UV LED light source and instead of the linear mercury lamps with power density 80W/cm -120W/cm.

         - Packaging Technology -         

Thermal management is critical in high power LED applications. The UV LEDs have the lowest thermal resistance of any LED on the market with a thermal resistance from junction to heat sink of 0.3°C/W or 0.35°C/W. This allows the LED to be driven at higher current densities while maintaining a low junction temperature, thereby resulting in brighter solutions and longer lifetimes.

         - Reliability Technology -         

Designed from the ground up, the COB Multi-chips LEDs are one of the most reliable light sources in the world today. COB Multi-chips LEDs have passed a rigorous suite of environmental and mechanical stress tests, including mechanical shock, vibration, temperature cycling and humidity, and high current applications. With very low failure rates and median lifetimes that typically exceed 10,000 hours, the COB Multi-chips LEDs are ready for evern the most demanding applications.

         - Environmental Benefits -         

Our LEDs help reduce power consumption and the amount of hazardous waste entering the environment. All COB Multi-chips LED products manufactured by us are RoHS compliant and free fo hazardous materials, including lead and mercury.

         The Advantages of COB Multi-chips LEDs         

Every LED is fully designed to ensure that it meets the high quality standards expected from our products.

>>> Low Thermal Resistance <0.16°C/W / High thermal conductivity 401W/(m.K)

       Copper Substrate and LED Chip Direct Bonding on Cu Base

>>> Special Reflecting Surface

       No Ag Plating, Anti-Sulfide, and Low Light Decay.

>>> Ni Coating at the Cu substrate bottom

       Anti-Oxidized and SMT Compatible.

COB Multi-chips LEDs

      Package Dimensions (mm)      

1.)	LED Array :	8s20p
2.)	Typical Voltage:	28V
3.)	Operating Current:	6000mA

Notes: (1) All dimensions are in millimeters. (2) Tolerance is ±0.25mm

      Electrical / Optical Characteristics (Ta=25°C)      

Optical Characteristics (Ta=25°C)

Parameter	Symbol	Wavelength	Conditions	Min.	Typ.	Max.	Units
Irradiance Note[1]	Ee	365-370nm	IF=6000mA	1.5	2	-	W/cm2
		370-380nm		2.0	2.5	-
		380-390nm		3	3.4	-
		390-410nm		4	5.5	-
View Angle	2θ1/2	X-Axis	IF=6000mA	140	150	160	Degree
		Y-Axis		120	130	140

Note: [1] Irradiance measured by DYMAX ACCU-CAL 50-LED Meter, and the distance of test is 5 mm.

Over Current Optical Characteristics (Ta=25°C)

Parameter	Symbol	Wavelength	Conditions	Min.	Typ.	Max.	Units
Irradiance Note[1]	Ee	365-370nm	IF=12000mA	-	4	-	W/cm2
		370-380nm		-	5	-
		380-390nm		-	6	-
		390-410nm		-	8	-

Note: [1] Irradiance measured by DYMAX ACCU-CAL 50-LED Meter, and the distance of test is 5 mm.

         [2] Recommended water cooling heatsink, with board temperature controlled around 40°C.

Electronic Characteristics (Ta=25°C)

Parameter	Symbol	Conditions	Min.	Typ.	Max.	Units
Forward Voltage	VF	IF=6000mA	26	-	30	V
Reverse Current Note[1]	Ir	VR=5V			10	uA
Thermal Resistance JunctionTo Board	RthJ-B	IF=6000mA		0.1		°C/W
Temperature Coefficient of Forward Voltage	ΔVF/ΔT	IF=6000mA		-64	-	mV/°C

Note: [1] Singe chip VR

Absolute Maximum Rating (Ta=25°C)

Parameter	Symbol	Conditions	Units
Power Dissipation	PD	360	W
Continuous Forward Current Note[1]	IF	12,000	mA
LED Junction Temperature	Tj	120	/°C
Operating Temperature Range	Topr	30℃ To +80℃
Storage Temperature Range	Tstg	-40℃ To +100℃
Manual Soldering Temperature	Tsol	260℃±20℃ For 3-5 Seconds
ESD Sensitivity Note[2]	ESD	500V HBM

Note: [1] Recommended water cooling heatsink, with board temperature controlled around 40°C.

[2] Singe chip ESD.

         Optical & Electric Characteristics         

Relative Power vs Distance (at central point ), I F =6000mA

Relative Power vs X-Axis , I F =6000mA

Relative Power vs Y-Axis , I F =6000mA

Relative Power vs Forward Current (IF)

Relative Power vs Board Temperature (Tb )

Forward Voltage vs Board Temperature (Tb )

.

         UV COB LED Reliability         

UC-160-VH (B50,L70) Lifetimes @ IF=6000mA

         UV COB LED Spectrum Distribution         

.

         Assembly Notice         

Do not touch emitting area.
- Do not touch or scratch silicon forming matrix area since it could damage the bonding of LED chipsor wires and cause dead zone.


Don’t touch the surface of Emitter



Assembly guideline
- Wiring emitter’s anode/cathode pad, then fix emitter with screws onto heat sink.





Soldering methods
a) Set up the temperature of welding head to 400±10°C when soldering.
b) Put Emitter on a 100±10°C hot plate and set up welding head temperature to 300±10°C
c) Either is OK.




Wires
- Suggested using strand wires (softer) to connect power, don’t use solid wires.