Chingtek Electronics Corp.

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UV LED - 160W G2 Ultimate - COB type

(UVA 365nm - 415nm )

The Easiest installation Powerful High Power Board
to Start UV LED Curing!

The specially designed high heat dissipation, well designed for high power UV LED operation!

¡E High heat dissipation brings more life span

¡E More current scaling potential with high power operation

¡E Easy start up for module/UV curing system design

How to install the UV LED unit into modules?

	You must need:
1.	Air/Water cooling heat sink:
	The lower temperature you maintain on the COB board,
	the more intensity power you can run up to, along with longer life span.
2.	UV LED power driver
	It's better with dimming function, but must be constant current supply.

Our customer¡¦s project for reference !!

	----- Key Features -----
>	395nm irradiation intensity 8W/cm2~11W/cm2,
	365nm irradiation intensity 4W/cm2~ 5W/cm2
>	Board dimension of 56mm x 28mm, Basic power 160W With fine
	heat dissipation , able to scale 320W (Need more cooling)
>	Irradiation intensity scales high at higher current !
	(> 6 A operation) High thermal conductivity package
¡E	Environmentally friendly: RoHS compliant, mercury-free
¡E	Variable drive currents: less than 4.5A through 12A or higher
¡E	Easy use for Linear UV light source

	----- Applications -----
-	Curing:
	> Inks > Coatings > Adhesives
-	Inspection
-	Machine Vision
-	Fiber-coupled illumination
-	Specialty Projection Systems for Maskless Lithography
-	Rapid Prototyping and 3D printing
-	Medical and Scientific Instrumentation

 

	Package Dimensions (mm) :

1.)	LED Array :	8s20p
2.)	Typical Voltage:	28V
3.)	Operating Current:	6000mA

Notes: (1) All dimensions are in millimeters. (2) Tolerance is ¡Ó0.25mm

Technology of Overviews

The COB Multi-chips LED package benefit from innovations in device technology, chip package and thermalmanagement. This suite of technologies give engineers and system designers the freedom to develop solutions both high in power and efficiency.
The Technology		Reliability Technology
our technology enables to emit large area photons uniformly over the entire COB UV LED surface. The intense optical power density produced by these multi-chips facilitate designs which replace mercury lamps where arrays of traditional power LEDs cannot.		Designed from the ground up, the COB Multi-chips LEDs are one of the most reliable light sources in the world today. COB Multi-chips LEDs have passed a rigorous suite of environmental and mechanical stress tests, including mechanical shock, vibration, temperature cycling and humidity, and high current applications. With very low failure rates and median lifetimes that typically exceed 10,000 hours, the COB Multi-chips LEDs are ready for evern the most demanding applications.
For UV devices, the side-less structure to let the engineers easy to design the linear UV LED light source and instead of the linear mercury lamps with power density 80W/cm -120W/cm.
Packaging Technology		Environmental Benefits
Thermal management is critical in high power LED applications. The UV LEDs have the lowest thermal resistance of any LED on the market with a thermal resistance from junction to heat sink of 0.3¢XC/W or 0.35¢XC/W. This allows the LED to be driven at higher current densities while maintaining a low junction temperature, thereby resulting in brighter solutions and longer lifetimes.		our LEDs help reduce power consumption and the amount of hazardous waste entering the environment. All COB Multi-chips LED products manufactured by us are RoHS compliant and free fo hazardous materials, including lead and mercury.

The Advantages of COB Multi-chips LEDs

Every LED is fully designed to ensure that it meets the high quality standards expected from our products.
>>>	Low Thermal Resistance <0.16¢XC/W / High thermal conductivity 401W/(m.K)
	Copper Substrate and LED Chip Direct Bonding on Cu Base
>>>	Special Reflecting Surface
	No Ag Plating, Anti-Sulfide, and Low Light Decay.
>>>	Ni Coating at the Cu substrate bottom
	Anti-Oxidized and SMT Compatible.

Electrical/Optical Characteristics (Ta=25¢XC)

Optical Characteristics (Ta=25¢XC)

Parameter	Symbol	Wavelength	Conditions	Min.	Typ.	Max.	Units
Irradiance Note[1]	Ee	365-370nm	IF=6000mA	1.5	2	-	W/cm2
		370-380nm		2.0	2.5	-
		380-390nm		3	3.4	-
		390-410nm		4	5.5	-
View Angle	2£c1/2	X-Axis	IF=6000mA	140	150	160	Degree
		Y-Axis		120	130	140

Note: [1] Irradiance measured by DYMAX ACCU-CAL 50-LED Meter, and the distance of test is 5 mm.

Over Current Optical Characteristics (Ta=25¢XC)

Parameter	Symbol	Wavelength	Conditions	Min.	Typ.	Max.	Units
Irradiance Note[1]	Ee	365-370nm	IF=12000mA	-	4	-	W/cm2
		370-380nm		-	5	-
		380-390nm		-	6	-
		390-410nm		-	8	-

Note: [1] Irradiance measured by DYMAX ACCU-CAL 50-LED Meter, and the distance of test is 5 mm.
[2] Recommended water cooling heatsink, with board temperature controlled around 40¢XC.

Electronic Characteristics (Ta=25¢XC)

Parameter	Symbol	Conditions	Min.	Typ.	Max.	Units
Forward Voltage	VF	IF=6000mA	26	-	30	V
Reverse Current Note[1]	Ir	VR=5V			10	uA
Thermal Resistance JunctionTo Board	RthJ-B	IF=6000mA		0.1		¢XC/W
Temperature Coefficient of Forward Voltage	£GVF/£GT	IF=6000mA		-64	-	mV/¢XC

Note: [1] Singe chip VR

Absolute Maximum Rating (Ta=25¢XC)

Parameter	Symbol	Conditions	Units
Power Dissipation	PD	360	W
Continuous Forward Current Note[1]	IF	12,000	mA
LED Junction Temperature	Tj	120	/¢XC
Operating Temperature Range	Topr	30¢J To +80¢J
Storage Temperature Range	Tstg	-40¢J To +100¢J
Manual Soldering Temperature	Tsol	260¢J¡Ó20¢J For 3-5 Seconds
ESD Sensitivity Note[2]	ESD	500V HBM

Note: [1] Recommended water cooling heatsink, with board temperature controlled around 40¢XC.
[2] Singe chip ESD.

Optical & Electric Characteristics

Relative Power vs Distance (at central point ), I F =6000mA



Relative Power vs X-Axis , I F =6000mA



Relative Power vs Y-Axis , I F =6000mA




Relative Power vs Forward Current (IF)




Relative Power vs Board Temperature (Tb )




Forward Voltage vs Board Temperature (Tb )

UV COB LED Reliability

UC-160-VH (B50,L70) Lifetimes @ IF=6000mA

UV COB LED Spectrum Distribution

Assembly Notice

1)	Do not touch emitting area.
-	Do not touch or scratch silicon forming matrix area since it could damage the bonding
	of LED chipsor wires and cause dead zone.
	Don¡¦t touch the surface of Emitter
2.)	Assembly guideline
	Wiring emitter¡¦s anode/cathode pad, then fix emitter with screws onto heat sink.
3.)	Soldering methods
	a) Set up the temperature of welding head to 400¡Ó10¢J when soldering.
	b) Put Emitter on a 100¡Ó10¢J hot plate and set up welding head temperature to 300¡Ó10¢J
	c) Either is OK.
4.)	Wires
	Suggested using strand wires (softer) to connect power, don¡¦t use solid wires.

Used Notice

1.)	In order to avoid absorption of moisture, it is recommended that the products are sotred in the dry
	box (or desiccators) with a desiccants. Alternatively the following environment is recommended.
	Storage temperature: 5¢XC ~ 30¢XC , Humidity: 60% HR Max.
2.)	Soldering rapidly cooling should be avoided.
3.)	Products should not be assembly on distorted surface of heat sink.
4.)	Products should not contact with any types of fluid, such as water, oil, organic solvents,...etc.
5.)	The maximum ambient temperature should be taken into consideration when determining the
	operating current.
6.)	This product must be driven by constant power supplier.
7.)	ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist bands
	or anti-electrostatic gloves be used when handing the LEDs. All devices, equipment, and
	machinery should be properly grounded.
8.)	The appearance and specifications of product may be modified for improvement without notice.

Ordering Information

Color	Order Code	Peak Wavelength (nm)		Light Intensity (W/cm2 )@6000mA
		Min	Max	Min	Max
UV	UVA-160-415VH	410	420	4	6
	UVA-160-405VH	400	410	4	6
	UVA-160-395VH	390	400	4	6
	UVA-160-385VH	380	390	3	4
	UVA-160-375VH	370	380	2	2.5
	UVA-160-365VH	365	370	1.5	2

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