UV LED Chip module - UVA UVB UVC 265nm 275nm 300nm 365nm 375nm 385nm 395nm 405nm For Industrial UV curing sterilization printing exposure system - UV.Chingtek.net
UV.Chingtek.net UV.Chingtek.net
6-1 High Power ultraviolet UV LED module/lamp 160W/320W ( 365nm 375nm 385nm 395nm 405nm) - G2 Ultimate - COB type - UV.Chingtek.net
6-2 High Power ultraviolet UV LED module/lamp 100W/200W ( 365nm 375nm 385nm 395nm 405nm) - Spotlight 60D - COB type - UV.Chingtek.net
6-3 High Power ultraviolet UV LED module/lamp 20W ( 365nm 375nm 385nm 395nm 405nm) - COB type - UV.Chingtek.net


High Power UV LED module/lamp

( 20W COB type )

High Power ultraviolet UV LED module/lamp 20W ( 365nm 375nm 385nm 395nm 405nm) - COB type - UV.Chingtek.net

UVA 365nm - 415nm



         Key Features         


  1. Supply wide UV-A wavelength from 365nm to 415nm.

  2. Half Angle (2θ1/2) : 120°

  3. Lens Color : Silicone Water Clear.

  4. Die Direct bonding to copper.

  5. High thermal conductivity: 401W/(m·K)

  6. Thermocouple attach point.

  7. Chip on Board high heat dissipation structure.

  8. Environmentally friendly: RoHS compliant, mercury-free.





         Technology of Overviews         


The Multi-chips LED package benefit from innovations in device technology, chip package and thermalmanagement. This suite of technologies give engineers and system designers the freedom to develop solutions both high in power and efficiency.


         - The Technology -         

Our technology enables to emit large area photons uniformly over the entire COB UV LED surface. The intense optical power density produced by these multi-chips facilitate designs which replace mercury lamps where arrays of traditional power LEDs cannot.

For UV devices, the side-less structure to let the engineers easy to design the linear UV LED light source and instead of the linear mercury lamps with power density 80W/cm -120W/cm.

         - Packaging Technology -         

Thermal management is critical in high power LED applications. The UV LEDs have the lowest thermal resistance of any LED on the market with a thermal resistance from junction to heat sink of 0.3°C/W or 0.35°C/W. This allows the LED to be driven at higher current densities while maintaining a low junction temperature, thereby resulting in brighter solutions and longer lifetimes.

         - Reliability Technology -         

Designed from the ground up, the COB Multi-chips LEDs are one of the most reliable light sources in the world today. COB Multi-chips LEDs have passed a rigorous suite of environmental and mechanical stress tests, including mechanical shock, vibration, temperature cycling and humidity, and high current applications. With very low failure rates and median lifetimes that typically exceed 10,000 hours, the COB Multi-chips LEDs are ready for evern the most demanding applications.

         - Environmental Benefits -         

Our LEDs help reduce power consumption and the amount of hazardous waste entering the environment. All COB Multi-chips LED products manufactured by us are RoHS compliant and free fo hazardous materials, including lead and mercury.





         The Advantages of COB Multi-chips LEDs         


Every LED is fully designed to ensure that it meets the high quality standards expected from our products.


>>> Low Thermal Resistance <0.16°C/W / High thermal conductivity 401W/(m.K)

       Copper Substrate and LED Chip Direct Bonding on Cu Base


>>> Special Reflecting Surface

       No Ag Plating, Anti-Sulfide, and Low Light Decay.


>>> Ni Coating at the Cu substrate bottom

       Anti-Oxidized and SMT Compatible.



COB Multi-chips LEDs

COB Multi-chips LEDs - High Power ultraviolet UV LED module/lamp 20W ( 365nm 375nm 385nm 395nm 405nm) - COB type - UV.Chingtek.net




      Package Dimensions (mm)      


Package Dimensions - High Power ultraviolet UV LED module/lamp 20W ( 365nm 375nm 385nm 395nm 405nm) - COB type - UV.Chingtek.net
1.) LED Array : 4s4p
2.) Typical Voltage: 14V
3.) Operating Current: 1400mA

Notes: (1) All dimensions are in millimeters. (2) Tolerance is ±0.25mm





      Electrical / Optical Characteristics (Ta=25°C)      


Parameter
Symbol
Conditions
Min.
Typ.
Max.
Units
Irradiance Note[1]
Ee
IF=1400mA
360
mW/cm2
Peak Wavelength
ELP
IF=1400mA
365
420
nm
Forward Voltage
VF
IF=1400mA
12
16

V

Thermal Resistance
JunctionTo Board
RthJ-B
IF=1400mA
0.2
°C/W
Temperature
Coefficient of
Forward Voltage
ΔVF/ΔT
IF=1400mA
8
mV/°C
Reverse Current
IR
VR=5V
10
μA
Viewing Angle Note[2]
2θ1/2
IF=1400mA
100
120
140
Degree
Note : [1] Irradiance measured by UV Intensity Meter, and the distance of Test is 5mm.
[2] Tolerance θ:10°

Absolute Maximum Rating (Ta=25°C)

Parameter
Symbol
Conditions
Units
Power Dissipation
PD
20

W

Continuous Forward Current
IF
2000
mA
Peak Forward CurrentNote[1]
IF(Peak)
2800
mA
LED Junction Temperature
Tj
120
/°C
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
30°C To +80°C
Storage Temperature Range
Tstg
-40°C To +100°C
Manual Soldering Temperature
Tsol
260°C ± 20°C For 3-5 Seconds
ESD Sensitivity Note[2]
ESD
500V HBM
Note: [1] 1/10 Duty Cycle 0.1ms Pulse Width.
[2] Singe chip ESD.





         UV COB LED Spectrum Distribution         


.

UV COB LED Spectrum Distribution - COB Multi-chips LEDs - High Power ultraviolet UV LED module/lamp 20W ( 365nm 375nm 385nm 395nm 405nm) - COB type - UV.Chingtek.net



         Assembly Notice         



  1. Do not touch emitting area.
    - Do not touch or scratch silicon forming matrix area since it could damage the bonding of LED chipsor wires and cause dead zone.

  2. COB Multi-chips LEDs - High Power ultraviolet UV LED module/lamp 20W ( 365nm 375nm 385nm 395nm 405nm) - COB type - UV.Chingtek.net Don’t touch the surface of Emitter

  3. Assembly guideline
    - Wiring emitter’s anode/cathode pad, then fix emitter with screws onto heat sink.

  4. Soldering methods
    a) Set up the temperature of welding head to 400±10°C when soldering.
    b) Put Emitter on a 100±10°C hot plate and set up welding head temperature to 300±10°C
    c) Either is OK.

  5. Wires
    - Suggested using strand wires (softer) to connect power, don’t use solid wires.




         Used Notice         



  1. In order to avoid absorption of moisture, it is recommended that the products are sotred in the dry box (or desiccators) with a desiccants. Alternatively the following environment is recommended. Storage temperature: 5°C ~ 30°C , Humidity: 60% HR Max.

  2. If the storage conditions are of high humidity the product should be dried before use. Recommended drying conditions: 12 hours at 100°C±5°C

  3. Any mechanical force or any excess vibration should be avoid during the cooling process after soldering.

  4. Reflow rapidly cooling should be avoided.

  5. Components should not be mounted on distorted Printed Circuit Boards.

  6. Devices should not contact with any types of fluid, such as water , oil , organic solvents…. etc.

  7. The maximum ambient temperature should be taken into consideration when determining the operating current.

  8. Devices should be soldered within 7 days after opening the moisture-proof packing.

  9. Repack unused product in anti-moisture packing, fold to close any opening and store in a dry place.

  10. The appearance and specifications of devices may be modified for improvement without notice.

  11. ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist bands or anti-electrostatic gloves be used when handing the LEDs . All devices, equipment and machinery should be properly grounded.

  12. This product must be driven by constant power supplier.




         Ordering Information         


Color
Order Code
Peak
Wavelength (nm)
Min
Max
UV
UVA-016-415
410
420
UVA-016-405
400
410
UVA-016-395
390
400
UVA-016-385
380
390
UVA-016-375
370
380
UVA-016-365
365
370

      

  P.S.  

  1. Caution !! Do not look directly at the UV light , and please wear safety Goggles.

UV LED Printing module/lamp - 150W for Standard UV ink System - 30m / min. - UV.Chingtek.net

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      Introduction of accessories      


CK-UV400 Anti-UV 400nm Safety goggles



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