UV LED Chip module - UVA UVB UVC 265nm 275nm 300nm 365nm 375nm 385nm 395nm 405nm For Industrial UV curing sterilization printing exposure system - Chingtek.net
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9-1 High Power Cool White LED - 3W ( emitter packing )( 5000K - 7000K ) - Chingtek.net
9-2 High Power RYGB LED - 3W ( emitter packing )( 440nm - 650nm ) - Chingtek.net
9-3 High Power Infrared LED - 3W ( emitter packing )( 660nm - 940nm ) - Chingtek.net


High Power RYGB LED - 3W ( emitter packing )

440nm - 650nm

High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net


         Key Features         


  1. 3W High Power Emitter LED.

  2. Half Angle (2θ1/2) : 140°

  3. Lens Color : Silicone Water Clear.

  4. Silicone compression molding lens.



         Applications          


  1. Entertainment Lighting

  2. Decorative Lighting

  3. Architectural Lighting

  4. Signal / Display



         Package Dimensions (mm) :         


High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net
Notes :
1. All dimensions are in millimeters
2. Tolerance is ±0.25mm


         Electrical/Optical Characteristics (Ta=25°C)         


ParameterP
Symbol
Conditions
Min.
Typ.
Max.
Units
Luminous Flux
Φv
IF=700mA
5.6
420
lm
Dominate Wavelength
WLD
IF=700mA
440
650
nm
Forward Voltage
VF
IF=700mA
1.8
5.2

V
Thermal Resistance
JunctionTo Board
RthJ-B
IF=700mA
13
°C/W
Temperature
Coefficient of
Forward Voltage
ΔVF/ΔT
IF=700mA
2
mV/°C
Reverse Current
IR
VR=5V
10
μA
Viewing Angle Note[1]
2θ1/2
IF=700mA
130
140
150
Degree


         Absolute Maximum Rating (Ta=25°C)         

Parameter
Symbol
Conditions
Units
Power Dissipation
PD
3
W
Continuous Forward Current
IF
700
mA
Peak Forward Current Note[2]
IF(Peak)
1000
mA
LED Junction Temperature
Tj
120
/°C
Reverse Voltage
VR
5
V
Operating Temperature Range
Topr
30°C To +80°C
Storage Temperature Range
Tstg
-40°C To +100°C
Manual Soldering Temperature
Tsol
260°C±20°C For 3-5 Seconds
ESD Sensitivity
ESD
2000V HBM
Note:
[1] Tolerance θ:10° .
[2] 1/10 Duty Cycle 0.1ms Pulse Width.




         Spectrum Distribution         

High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net


         Characteristic Curves         

High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net


         Typical Radiation Pattern         

High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net
High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net


         Typical Reflow Soldering Profile         

High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net
Profile Feature
Typical parameters
Average Ramp-Up Rate (Ts max to Tp)
3 °C/second max.
Preheat Temperature Min (Ts min )
150 °C
Preheat Temperature Max (Ts max )
200 °C
Time (ts min to ts max )
60-180 seconds
Time maintained above Temperature (TL)
217 °C
Time maintained above Time (tL)
60-150 seconds
Peak/Classification Temperature (Tp)
260 °C
Time within 5 °C of Actual Peak Temperature (tp)
5 seconds
Ramp-Down Rate
6 °C/second max.
Time 25 °C to Peak Temperature
8 minutes max.


         Tube Packing         

High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net
Unit : mm
W1
W2
H1
H2
L

16.5
9.6
8.0
3.4
424.0
±0.2
±0.2
±0.2
±0.2
±2.0


         Tape-and-Reel Packing         


- Reel dimensions - High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net
Unit : mm
M
N
W
W1
H
K
S

Φ330.0
Φ99.5
24.4
29.0
Φ13.5
10.75
2.5
±1.0
±1.0
±1.0
±1.0
±0.5
±0.5
±0.5


- Carrier tape dimensions - High power Red Yellow Green Blue LED chips 3W by emitter packing - 450nm 460nm 520nm 620nm - Chingtek.net
Unit : mm
W
P
E
F
P2
D
D1
P0
A0
B0
K0
T

24.0
12.0
1.75
11.5
2.0
1.5
1.5
4.0
8.45
15.0
5.10
0.37
±0.3
±0.1
±0.1
±0.1
±0.1
±0.1
±0.25
±0.1
±0.1
±0.1
±0.1
±0.02


         Used Notice         



  1. In order to avoid absorption of moisture, it is recommended that the products are sotred in the dry box (or desiccators) with a desiccants. Alternatively the following environment is recommended. Storage temperature: 5°C ~ 30°C , Humidity: 60% HR Max.

  2. If the storage conditions are of high humidity the product should be dried before use. Recommended drying conditions: 12 hours at 100°C±5°C

  3. Any mechanical force or any excess vibration should be avoid during the cooling process after soldering.

  4. Reflow rapidly cooling should be avoided.

  5. Components should not be mounted on distorted Printed Circuit Boards.

  6. Devices should not contact with any types of fluid, such as water , oil , organic solvents…. etc.

  7. The maximum ambient temperature should be taken into consideration when determining the operating current.

  8. Devices should be soldered within 7 days after opening the moisture-proof packing.

  9. Repack unused product in anti-moisture packing, fold to close any opening and store in a dry place.

  10. The appearance and specifications of devices may be modified for improvement without notice.

  11. ESD Precautions Static Electricity and surge damages LEDs. It is recommended that wrist bands or anti-electrostatic gloves be used when handing the LEDs . All devices, equipment and machinery should be properly grounded.

  12. This product must be driven by constant power supplier.




         Ordering Information         


Color
Order Code
Dominate
Wavelength (nm)
Min
Max
RYGB
LED-003-450
445
455
LED-003-460
455
465
LED-003-520
515
525
LED-003-620
615
625

      

  P.S.  

  1. Caution !! Do not look directly at the UV light , and please wear safety Goggles.


UV_danger - Chingtek.net

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